Enter Die Dimensions (width, height), scribe lane (horizontal/vertical mostly == 0.1). Depending on the wafer diameter and edge Loss area, the maximum number of Dies and wafer map will be automatically updated. User can select Map centering (Die or wafer centered). The number of Good Dies will be as well calculated, using AMDy’s model of Die Yield with switchable alpha and Defect density as input.
PARAMETERS | WAFER MAP |
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